OPA316_16 Datasheet, PDF (3/48 Pages) Texas Instruments – 10-MHz, Low-Power, Low-Noise, RRIO, 1.8-V CMOS Operational Amplifier

www.ti.com
5 Pin Configuration and Functions
DCK Package
SC70-5
(Top View)
+IN 1
V- 2
-IN 3
5 V+
4 OUT
DBV Package
SOT23-5
(Top View)
OUT 1
V- 2
+IN 3
5 V+
4 -IN
DRG Package⁽¹⁾
DFN-8
(Top View)
OUT A 1
-IN A 2
+IN A 3
V- 4
8
Exposed
Thermal ₇
Die Pad
on
6
Underside⁽²⁾
5
V+
OUT B
-IN B
+IN B
Pitch: 0.5 mm.
Connect thermal pad to V–. Pad size: 2.00 mm × 1.20 mm.
D, DGK Packages
SO-8, MSOP-8
(Top View)
OUT A 1
-IN A 2
+IN A 3
V- 4
8 V+
7 OUT B
6 -IN B
5 +IN B
OPA316, OPA2316, OPA2316S, OPA4316
SBOS703E – APRIL 2014 – REVISED JUNE 2016
DGS Package
MSOP-10
(Top View)
OUT A 1
–IN A 2
A
+IN A 3
V– 4
SHDN A 5
10 V+
9 OUT B
8 –IN B
B
7 +IN B
6 SHDN B
RUG Package
QFN-10
(Top View)
+IN A
10
V±
1
9
±IN A
SHDN A
2
8
OUT A
SHDN B
3
7
V+
+IN B
4
6
OUT B
5
±IN B
PW Package
TSSOP-14
(Top View)
OUT A 1
-IN A 2
+IN A 3
V+ 4
+IN B 5
-IN B 6
OUT B 7
14 OUT D
A
D
13 -IN D
12 +IN D
11 V-
10 +IN C
B
C
9 -IN C
8 OUT C
Copyright © 2014–2016, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316