LP3936 Datasheet, PDF (3/30 Pages) National Semiconductor (TI) – Lighting Management System for Six White LEDs and One RGB or FLASH LED

LP3936
www.ti.com
Pin
Name
21
NRST
22
CS
23
DO
24
DI
25
SCL
26
RGB_EN
27
V_{DD_IO}
28
ROUT
29
GOUT
30
BOUT
31
GND_RGB
32
OUT
SNVS259D – NOVEMBER 2003 – REVISED MAY 2013
Pin Description (continued)
Type
Description
Logic Input
Low Active Reset Input
Logic Input/Output MicroWire Chip-Select (in) / I²C SDA (in/out)
Logic Output MicroWire Data Output
Logic Input
Logic Input
MicroWire Data Input
MicroWire Clock / I²C SCL Input
Logic Input
LED Control for On/Off or PWM Dimming
Power
Supply Voltage for Logic IO signals
LED Output Open Drain Output, Red LED
LED Output Open Drain Output, Green LED
LED Output Open Drain Output, Blue LED
Ground
Ground for RGB Drivers
Output
Open Drain, Boost Converter Power Switch
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
V_DD1, V_DD2, V_{DD_IO}, V(OUT, FB)
Voltage on Logic Pins
Voltage on LED Output Pins
Voltage on All Other Pins
I (ROUT, GOUT, BOUT)
I (V_REF)
Continuous Power Dissipation⁽⁴⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Reflow soldering, 3 times)⁽⁵⁾
-0.3V to 6.0V
-0.3V to V_{DD_IO} + 0.3V, with 6.0V max
-0.3V to V(FB) + 0.3V, with 6.0V max
-0.3V to V_DD1,2 + 0.3V, with 6.0V max
150 mA
10 µA
Internally Limited
125°C
−65°C to +150°C
260°C
ESD Rating⁽⁶⁾
Human Body Model:
Machine Model:
2 kV
200V
(1) All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).
(2) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics table.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 140°C (typ.).
(5) For detailed soldering specifications and information, see TI's AN--1125 Application Report (SNAA002).
(6) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings⁽¹⁾⁽²⁾
V_DD1, V_DD2
V_{DD_IO}
Recommended Load Current
Junction Temperature (T_J) Range
3.0V to 6.0V
1.65V – V_DD1,2
0 mA to 250 mA
−40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics table.
(2) All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).
Copyright © 2003–2013, Texas Instruments Incorporated
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