TMS320F28030_16 Datasheet, PDF (29/160 Pages) Texas Instruments – Piccolo Microcontrollers

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TMS320F28030, TMS320F28031, TMS320F28032
TMS320F28033, TMS320F28034, TMS320F28035
SPRS584K – APRIL 2009 – REVISED JUNE 2016
5.6.3 RSH Package
°C/W ⁽¹⁾
AIR FLOW (lfm)⁽²⁾
RΘ_JC
RΘ_JB
Junction-to-case thermal resistance
Junction-to-board thermal resistance
14.7
N/A
9.2
N/A
34.8
0
RΘ_JA
(High k PCB)
Junction-to-free air thermal resistance
23.6
150
22.3
250
20.5
500
0.24
0
Psi_JT
Junction-to-package top
0.36
150
0.43
250
0.56
500
9.2
0
Psi_JB
Junction-to-board
8.8
150
8.9
250
8.8
500
(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
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Specifications
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TMS320F28035