THS3202_16 Datasheet, PDF (27/37 Pages) Texas Instruments – 2-GHz, LOW DISTORTION, DUAL CURRENT-FEEDBACK AMPLIFIERS

PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2016
PACKAGING INFORMATION
Orderable Device
THS3202D
THS3202DG4
THS3202DGK
THS3202DGKG4
THS3202DGKR
THS3202DGN
THS3202DGNG4
THS3202DGNR
THS3202DGNRG4
Status
(1)
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
Package Type Package Pins Package Eco Plan
Drawing
Qty
(2)
SOIC
D
8
75 Green (RoHS
& no Sb/Br)
SOIC
D
8
75 Green (RoHS
& no Sb/Br)
VSSOP
DGK 8
80 Green (RoHS
& no Sb/Br)
VSSOP
DGK 8
80 Green (RoHS
& no Sb/Br)
VSSOP
DGK 8
TBD
MSOP-
DGN 8
PowerPAD
80 Green (RoHS
& no Sb/Br)
MSOP-
DGN 8
PowerPAD
80 Green (RoHS
& no Sb/Br)
MSOP-
DGN 8 2500 Green (RoHS
PowerPAD
& no Sb/Br)
MSOP-
DGN 8 2500 Green (RoHS
PowerPAD
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU |
CU NIPDAUAG
CU NIPDAU
CU NIPDAU |
CU NIPDAUAG
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Call TI
Level-1-260C-UNLIM
-40 to 85
-40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
3202
3202
BEV
BEV
BEV
BEP
BEP
BEP
BEP
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 1
Samples