MSP430F5529_17 Datasheet, PDF (23/128 Pages) Texas Instruments – Mixed-Signal Microcontrollers

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MSP430F5529, MSP430F5528, MSP430F5527, MSP430F5526
MSP430F5525, MSP430F5524, MSP430F5522, MSP430F5521
MSP430F5519, MSP430F5517, MSP430F5515, MSP430F5514, MSP430F5513
SLAS590M – MARCH 2009 – REVISED NOVEMBER 2015
5.6 Thermal Characteristics
PARAMETER
θ_JA Junction-to-ambient thermal resistance, still air
Low-K board (JESD51-3)
High-K board (JESD51-7)
θ_JC Junction-to-case thermal resistance
θ_JB Junction-to-board thermal resistance
LQFP (PN)
VQFN (RGC)
BGA (ZQE)
LQFP (PN)
VQFN (RGC)
BGA (ZQE)
LQFP (PN)
VQFN (RGC)
BGA (ZQE)
LQFP (PN)
VQFN (RGC)
BGA (ZQE)
VALUE
70
55
84
45
25
46
12
12
30
22
6
20
UNIT
°C/W
°C/W
°C/W
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Specifications
23
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Product Folder Links: MSP430F5529 MSP430F5528 MSP430F5527 MSP430F5526 MSP430F5525 MSP430F5524
MSP430F5522 MSP430F5521 MSP430F5519 MSP430F5517 MSP430F5515 MSP430F5514 MSP430F5513