THS7347_15 Datasheet, PDF (2/33 Pages) Texas Instruments – 3-Channel RGBHV Video Buffer with I2C Control, 2:1 Input Mux, Monitor Pass-Through, and Selectable Input Bias Modes

THS7347
SLOS531B – MAY 2007 – REVISED OCTOBER 2011
www.ti.com
DESCRIPTION, CONTINUED
As part of the THS7347 flexibility, the device input can be selected for ac- or dc-coupled inputs. The ac-coupled
modes include a sync-tip clamp option for CVBS/Y'/G'B'R' with sync or a fixed bias for the C'/P'_B/P'_R/R'G'B'
channels without sync. The dc input options include a dc input or a dc+Offset shift to allow for a full sync
dynamic range at the output with 0-V input.
The THS7347 is available in a lead-free, RoHS-compliant TQFP package.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGED DEVICES
THS7347IPHP
THS7347IPHPR
PACKAGING/ORDERING INFORMATION⁽¹⁾
PACKAGE TYPE
TRANSPORT MEDIA, QUANTITY
HTQFP-48 PowerPAD™
Tray, 250
Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range (unless otherwise noted).
V_SS
Supply voltage, GND to V_A or GND to V_DD
V_I
Input voltage
I_O
Continuous output current
Continuous power dissipation
T_J
Maximum junction temperature, any condition⁽²⁾
T_J
Maximum junction temperature, continuous operation, long term reliability⁽³⁾
T_stg
Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
HBM
ESD ratings
CDM
MM
THS7347
UNIT
5.5
V
–0.4 to V_A or V_DD
V
±80
mA
See Dissipation Rating Table
+150
°C
+125
°C
–65 to +150
°C
300
°C
1500
V
1500
V
100
V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
PACKAGE
HTQFP-48 with PowerPAD (PHP)
θ_JC
(°C/W)
1.2
θ_JA
(°C/W)
35
POWER RATING^{(1) (2)}
(T_J = +125°C)
T_A = +25°C
T_A = +85°C
2.85 W
1.14 W
(1) This data was taken with a PowerPAD standard 3-inch by 3-inch, 4-layer printed circuit board (PCB) with internal ground plane
connections to the PowerPAD.
(2) Power rating is determined with a junction temperature of +125°C. This temperature is the point where distortion starts to substantially
increase and long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction
temperature at or below +125°C for best performance and reliability.
2
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