English
Language : 

THS6032_14 Datasheet, PDF (2/35 Pages) Texas Instruments – LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
◁
THS6032
SLOS233F – APRIL 1999 – REVISED AUGUST 2009....................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The THS6032 is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This
device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for
driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power
consumption to 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number
of power supplies to two.
The class-G architecture supplies current to the load from four supplies. For low output voltages (typically –2.5 <
VO < +2.5), some of the output current is supplied from the +VCC(L) and –VCC(L) supplies (typically ±5 V). For large
output voltages (typically VO < –2.5 and VO > +2.5), the output current is supplied from +VCC(H) and –VCC(H)
(typically ±15 V). This current sharing between VCC(L) and VCC(H) minimizes power dissipation within the THS6032
output stages for high crest factor ADSL signals.
The THS6032 features a low-impedance shutdown mode, which allows the central office to receive incoming
calls even after the device has been shut down. The THS6032 is available packaged in the patented
PowerPAD ™ package. This package provides outstanding thermal characteristics in a small-footprint
surface-mount package, which is fully compatible with automated surface-mount assembly procedures. It is also
available in the new MicroStar Junior ™ BGA package. This package is only 25 mm2 in area, allowing for
high-density PCB designs.
Shutdown (SHDN1 and SHDN2) allows for powering down the internal circuitry for power conservation or for
multiplexing. Separate shutdown controls are available for each channel on the THS6032. The control levels are
TTL compatible. When turned off, each driver output is placed in a low impedance state which is determined by
the voltage at DGND. This virtual ground at the outputs allows proper termination of a transmission line.
TA
0°C to +70°C
–40°C to +85°C
PowerPAD PLASTIC
SMALL OUTLINE (2) (DWP)
THS6032CDWP
THS6032IDWP
AVAILABLE OPTIONS(1)
PACKAGED DEVICES
PowerPAD PLASTIC
MSOP (3) (GQE)
PowerPAD TQFP
(VFP)
THS6032CGQER
THS6032CVFP
THS6032IGQER
THS6032IVFP
EVALUATION
MODULES
THS6032 EVM (DWP package)
THS6032GQE EVM (GQE package)
—
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The DWP packages are available taped and reeled. Add an R suffix to the device type (for example, THS6032CDWPR).
(3) The GQE packages are only available taped and reeled.
2
Submit Documentation Feedback
Product Folder Link(s): THS6032
Copyright © 1999–2009, Texas Instruments Incorporated
 ▷