LMH6504 Datasheet, PDF (2/29 Pages) National Semiconductor (TI) – Wideband, Low Power, Variable Gain Amplifier

LMH6504
SNOSA96D – NOVEMBER 2003 – REVISED MARCH 2013
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DESCRIPTION CONTINUED
LMH6504 gain control is linear in dB for a large portion of the total gain control range. This makes the device
suitable for AGC applications. For linear gain control applications, see the LMH6503 data sheet.
The combination of minimal external components and small outline packages (SOIC and VSSOP) allows the
LMH6504 to be used in space-constrained applications.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾
ESD Tolerance ⁽²⁾:
Human Body Model
Machine Model
Input Current
Output Current
Supply Voltages (V⁺ - V^−)
Voltage at Input/ Output pins
Storage Temperature Range
Junction Temperature
Soldering Information:
Infrared or Convection (20 sec)
Wave Soldering (10 sec)
1000V
100V
±10 mA
120 mA ⁽³⁾
12.6V
V⁺ +0.8V, V^− −0.8V
−65°C to 150°C
150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum output current (I_OUT) is determined by device power dissipation limitations or value specified, whichever is lower.
Operating Ratings
Supply Voltages (V⁺ - V^−)
Temperature Range ⁽¹⁾
Thermal Resistance:
8-Pin SOIC
8-Pin VSSOP
(θ_JC)
60
65
(θ_JA)
165
235
7V to 12V
−40°C to +85°C
(1) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
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