AMC1200-Q1_16 Datasheet, PDF (2/30 Pages) Texas Instruments – Fully-Differential Isolation Amplifier

AMC1200-Q1
SBAS585A – SEPTEMBER 2012 – REVISED JANUARY 2016
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configurations and Functions ....................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 6
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 14
8 Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Applications ................................................ 15
9 Power Supply Recommendations...................... 18
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 Device and Documentation Support ................. 20
11.1 Documentation Support ........................................ 20
11.2 Community Resources.......................................... 20
11.3 Trademarks ........................................................... 20
11.4 Electrostatic Discharge Caution ............................ 20
11.5 Glossary ................................................................ 20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2012) to Revision A
Page
• Deleted last Features bullet ................................................................................................................................................... 1
• Added front-page image caption, ESD Ratings table, Feature Description section, Device Functional Modes section,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
• Added TI Design .................................................................................................................................................................... 1
• Changed front-page graphic .................................................................................................................................................. 1
• Changed Pin Configurations and Functions section: condensed pin out drawing into one because packages have
identical pin layout ................................................................................................................................................................. 3
• Moved Electrical Characteristics table before Regulatory Information table to comply with latest format ............................ 5
• Added PSRR to test conditions of Output, PSRR parameter in Electrical Characteristics table .......................................... 5
• Changed CTI parameter in Package Characteristics table: added DWV package row ...................................................... 13
• Added sentence to Design Requirements section .............................................................................................................. 16
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