AMC1200-Q1_16 Datasheet, PDF (13/30 Pages) Texas Instruments – Fully-Differential Isolation Amplifier

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AMC1200-Q1
SBAS585A – SEPTEMBER 2012 – REVISED JANUARY 2016
7.3.3 Package Characteristics
Creepage and clearance requirements should be applied according to the specific equipment isolation standards
of a specific application. Take care to maintain the creepage and clearance distance of the board design to
ensure that the mounting pads of the isolator on the printed-circuit-board (PCB) do not reduce this distance.
Creepage and clearance on a PCB become equal according to the measurement techniques shown in the TI
Isolation Glossary. Techniques such as inserting grooves and/or ribs on the PCB are used to help increase these
specifications.
L(I01)
L(I02)
CTI
R_IO
C_IO
C_I
PARAMETER
Minimum air gap
(clearance)
Minimum external tracking
(creepage)
Tracking resistance
(comparative tracking index)
Minimum internal gap
(internal clearance)
Isolation resistance
Barrier capacitance input to
output
Input capacitance to ground
TEST CONDITIONS
Shortest pin-to-pin distance
through air
DWV package
DUB package
Shortest pin-to-pin distance
across the package surface
DWV package
DUB package
DIN IEC 60112/VDE 0303 part ^{DWV package}
1
DUB package
Distance through the insulation
Input to output, V_IO = 500 V, all pins on each side of
the barrier tied together to create a two-pin device, T_A
< 85°C
Input to output, V_IO = 500 V,
85°C ≤ T_A < T_A max
V_I = 0.5 V_PP at 1 MHz
V_I = 0.5 V_PP at 1 MHz
MIN
TYP
8
7
8
7
600
400
0.014
> 10¹²
> 10¹¹
1.2
3
MAX UNIT
mm
mm
V
mm
Ω
pF
pF
7.3.4 Regulatory Information
VDE/IEC
Certified according to VDE V 0884-10
Certificate number: 40016131
UL
Recognized under 1577 component recognition program
File number: E181974
Copyright © 2012–2016, Texas Instruments Incorporated
Product Folder Links: AMC1200-Q1
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