AMC1200-Q1_16 Datasheet, PDF (12/30 Pages) Texas Instruments – Fully-Differential Isolation Amplifier

AMC1200-Q1
SBAS585A – SEPTEMBER 2012 – REVISED JANUARY 2016
7.3 Feature Description
7.3.1 Insulation Characteristics
over recommended operating conditions (unless otherwise noted)
V_IORM
V_PR
V_IOTM
V_ISO
R_S
PD
PARAMETER
TEST CONDITIONS
Maximum working
insulation voltage
Input to output test voltage
Qualification test: after input/output safety test subgroup
2/3,
V_PR = V_IORM × 1.2, t = 10 s, partial discharge < 5 pC
Qualification test: method a, after environmental tests
subgroup 1,
V_PR = V_IORM × 1.6, t = 10 s, partial discharge < 5 pC
100% production test: method b1, V_PR = V_IORM × 1.875,
t = 1 s, partial discharge < 5 pC
Transient overvoltage
Qualification test: t = 60 s
Insulation voltage per UL
Insulation resistance
Pollution degree
Qualification test: V_TEST = V_ISO, t = 60 s
100% production test: V_TEST = 1.2 × V_ISO, t = 1 s
V_IO = 500 V at T_S
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MIN
TYP
> 10⁹
2
MAX UNIT
1200 V_PEAK
1440
1920 ^VPEAK
2250
4250
4250
5100
V_PEAK
V_PEAK
Ω
PARAMETER
Surge immunity
Table 1. IEC 61000-4-5 Ratings
TEST CONDITIONS
1.2-μs and 50-μs voltage surge or 8-μs and 20-μs current
surge
VALUE
±6000
UNIT
V
PARAMETER
Basic isolation group
Installation classification
Table 2. IEC 60664-1 Ratings
TEST CONDITIONS
Material group
Rated mains voltage ≤ 150 V_RMS
Rated mains voltage ≤ 300 V_RMS
Rated mains voltage ≤ 400 V_RMS
Rated mains voltage < 600 V_RMS
SPECIFICATION
II
I-IV
I-IV
I-III
I-III
7.3.2 IEC Safety Limiting Values
Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output (I/O)
circuitry. A failure of the I/O circuitry can cause low resistance to ground or the supply and, without current
limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to
secondary system failures.
PARAMETER
I_S Safety input, output, or supply current
T_C Maximum case temperature
TEST CONDITIONS
θ_JA = 246°C/W, V_IN = 5.5 V, T_J = 150°C, T_A = 25°C
MIN TYP MAX UNIT
–10
10 mA
150 °C
The safety-limiting constraint is the maximum junction temperature specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application
hardware determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal
Information table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for
Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage
times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-
air thermal resistance.
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