TMS570LS1114_14 Datasheet, PDF (161/167 Pages) Texas Instruments – 16- and 32-Bit RISC Flash Microcontroller

TMS570LS1114
www.ti.com
7 Mechanical Data
SPNS188A – OCTOBER 2012 – REVISED SEPTEMBER 2013
7.1 Thermal Data
Table 7-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 7-2 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 7-1. Thermal Resistance Characteristics
(PGE Package)
PARAMETER
RΘ_JA
RΘ_JB
RΘ_JC
°C / W
40
27.2
7.3
Table 7-2. Thermal Resistance Characteristics
(ZWT Package)
PARAMETER
RΘ_JA
RΘ_JB
RΘ_JC
°C / W
18.8
14.1
7.1
7.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2012–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TMS570LS1114
Mechanical Data 161