BQ4010_14 Datasheet, PDF (13/16 Pages) Texas Instruments – 8 k ´ 8 NONVOLATILE SRAM (5 V, 3.3 V)

PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2014
PACKAGING INFORMATION
Orderable Device
BQ4010LYEBZ-70N
BQ4010LYMA-70
BQ4010LYMA-70N
BQ4010MA-150
BQ4010MA-200
BQ4010MA-70
BQ4010MA-85
BQ4010YMA-150
BQ4010YMA-150N
BQ4010YMA-200
BQ4010YMA-70
BQ4010YMA-70N
BQ4010YMA-85
BQ4010YMA-85N
Status Package Type Package Pins Package
(1)
Drawing
Qty
OBSOLETE DIP MODULE EBZ 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
OBSOLETE DIP MODULE MA 28
Eco Plan
(2)
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Lead/Ball Finish
(6)
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MSL Peak Temp
(3)
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Op Temp (°C)
0 to 70
-40 to 85
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
-40 to 85
0 to 70
-40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1