English
Language : 

OMAP3530ECUS Datasheet, PDF (123/264 Pages) Texas Instruments – OMAP3530/25 Applications Processor: OMAP 3 Architecture
www.ti.com
OMAP3530/25 Applications Processor
SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009
3.3 Recommended Operating Conditions
All OMAP3530/25 modules are used under the operating conditions contained in Table 3-3.
Note:
To avoid significant device degradation for commercial temperature OMAP3530/OMAP3525 devices (0°C
≤ Tj ≤ 90°C), the device power-on hours (POH) must be limited to one of the following:
• 100K total POH when operating across all OPPs and keeping the time spent at OPP5-OPP6 to less
than 23K POH.
• 50K total POH when operating at OPP5 - OPP6.
• 44K total POH with no restrictions to the proportion of these POH at operating points OPP1 - OPP6.
To avoid significant device degradation for extended temperature OMAP3530A/OMAP3525A devices
(-40°C ≤ Tj ≤ 105°C), the following restrictions apply:
• OPP5 and OPP6 are not supported.*
• The total device POH must be limited to less than 50K.*
*If an extended temperature device is operated such that Tj never exceeds 90C (-40°C ≤Tj ≤ 90°C) then
the OPP POH limits for commercial devices indicated above apply.
Note: Logic functions and parameter values are not assured out of the range specified in the
recommended operating conditions.
Table 3-3. Recommended Operating Conditions
PARAMETER
VDD1
(vdd_mpu_iva),
SmartReflex
Disabled
DESCRIPTION
OMAP processor logic supply
OPP6: Overdrive (1)
OPP5: Overdrive
OPP4: Mid-Overdrive
OPP3: Nominal
OPP2: Low-Power
VDD2 (vdd_core) OMAP core logic supply(3)
SmartReflex
Disabled
OPP1: Ultra
Low-Power (2)
OPP3: Nominal
OPP2: Low-Power
vdds
vdds_mem
vdds_mmc1
vdds_mmc1a
vdds_wkup_bg
OPP1: Ultra
Low-Power (2)
Supply voltage for I/O macros
Noise (peak-peak)
Supply voltage for memory I/O macros
Noise (peak-peak)
Supply voltage range for MMC1
CMD, CLK and DAT[3:0] and for
memory stick I/Os
1.8-V mode
3.0-V mode
Second supply voltage range for
MMC1 DAT[7:4]
1.8-V mode
3.0-V mode
Wakeup LDO
MIN
VDD1NOM -
(0.05*VDD1NOM)
VDD1NOM -
(0.05*VDD1NOM)
VDD1NOM -
(0.05*VDD1NOM)
VDD1NOM -
(0.05*VDD1NOM)
VDD1NOM -
(0.05*VDD1NOM)
VDD1NOM -
(0.05*VDD1NOM)
VDD2NOM -
(0.05*VDD2NOM)
VDD2NOM -
(0.05*VDD2NOM)
VDD2NOM -
(0.05*VDD2NOM)
1.71
NOM
1.35
1.35
1.27
1.20
1.06
0.985
1.15
1.06
0.985
1.8
1.71
1.8
1.71
1.8
2.7
3.0
1.71
1.8
2.7
3.0
1.71
1.8
MAX
VDD1NOM +
(0.05*VDD1NOM)
VDD1NOM +
(0.05*VDD1NOM)
VDD1NOM +
(0.05*VDD1NOM)
VDD1NOM +
(0.05*VDD1NOM)
VDD1NOM +
(0.05*VDD1NOM)
VDD1NOM +
(0.05*VDD1NOM)
VDD2NOM +
(0.05*VDD2NOM)
VDD2NOM +
(0.05*VDD2NOM)
VDD2NOM +
(0.05*VDD2NOM)
1.91
90
1.89
90
1.89
3.3
UNIT
V
V
V
V
V
V
V
V
V
V
mVpp
V
mVpp
V
V
1.89
V
3.3
1.89
V
(1) OPP6 is only supported on high-speed grade OMAP3530/25 devices.
(2) Cannot boot in OPP1. If OPP1 is desired, boot in higher OPP then switch to OPP1.
(3) Core logic includes interconnect, graphics processor, and peripherals.
Submit Documentation Feedback
ELECTRICAL CHARACTERISTICS 123