DRV8806 Datasheet, PDF (11/18 Pages) Texas Instruments – QUAD SERIAL INTERFACE LOW-SIDE DRIVER IC

DRV8806
www.ti.com
THERMAL INFORMATION
SLVSBA3 – JUNE 2012
Thermal Protection
The DRV8806 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately
150°C, the device will be disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high an ambient temperature.
Power Dissipation
Power dissipation in the DRV8806 is dominated by the power dissipated in the output FET resistance, or
RDS(ON). Average power dissipation of each FET when running a static load can be roughly estimated by
Equation 1:
P = R_DS(ON) · (I_OUT)²
(1)
where P is the power dissipation of one FET, R_DS(ON) is the resistance of each FET, and I_OUT is equal to the
average current drawn by the load. Note that at start-up and fault conditions this current is much higher than
normal running current; these peak currents and their duration also need to be taken into consideration. When
driving more than one load simultaneously, the power in all active output stages must be summed.
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and
heatsinking.
Note that R_DS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must
be taken into consideration when sizing the heatsink.
Heatsinking
The PowerPAD™ package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, refer to TI Application Report SLMA002, "PowerPAD™ Thermally
Enhanced Package" and TI Application Brief SLMA004, "PowerPAD™ Made Easy", available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): DRV8806
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