TLK2201A_16 Datasheet, PDF (10/20 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK2201A
TLK2201AI
SLLS572B – JUNE 2003 – REVISED SEPTEMBER 2007
www.ti.com
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_DD
Supply voltage⁽²⁾
V_I
Input voltage range at TTL terminals
Input voltage range at any other terminal
T_stg
Storage temperature
Electrostatic discharge
CDM
HDM
Characterized free-air operating temperature range
TLK2201A
TLK2201AI
VALUE
–0.3 to 3
–0.5 to 4
–0.3 to V_DD +0.3
–65 to 150
1
2
0 to 70
–40 to 85
UNIT
V
V
V
°C
kV
kV
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATINGS⁽¹⁾
PACKAGE
RCP64 ⁽³⁾
RCP64 ⁽⁴⁾
RCP64 ⁽⁵⁾
T_A ≤ 25°C
POWER RATING
5.25 W
3.17 W
2.01 W
OPERATING
FACTOR ⁽²⁾
ABOVE T_A = 25°C
46.58 mW/°C
23.70 mW/°C
13.19 mW/°C
TA = 70°C
POWER RATING
2.89 W
1.74 W
1.11 W
(1) For more information, refer to TI application note PowerPAD Thermally Enhanced Package
(SLMA002).
(2) This is the inverse of the traditional junction-to-ambient thermal resistance (R_θJA).
(3) 2 oz. Trace and copper pad with solder.
(4) 2 oz. Trace and copper pad without solder.
(5) Standard JEDEC high-K board
THERMAL CHARACTERISTICS
PARAMETER
R_θJA Junction-to-free-air thermal resistance
R_θJC Junction-to-case-thermal resistance
TEST CONDITIONS
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased
to thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased
to thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
MIN TYP MAX UNIT
21.47
42.20
°C/W
75.83
0.38
°C/W
0.38
7.8
10
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