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TMS320TCI6486 Datasheet, PDF (1/268 Pages) Texas Instruments – TMS320TCI6486 Communications Infrastructure Digital Signal Processor
TMS320TCI6486
www.ti.com
SPRS300N – FEBRUARY 2006 – REVISED JULY 2011
TMS320TCI6486 Communications Infrastructure Digital Signal Processor
1 Features
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• Six On-Chip TMS320C64x+ Megamodules
• Endianess: Little Endian, Big Endian
• C64x+ Megamodule Main Features:
– High-Performance, Fixed-Point
TMS320C64x+ DSP
– 500/625/700 MHz
– Eight 32-Bit Instructions/Cycle
– 4000 MIPS/MMACS (16-Bits) at 500 MHz
– Dedicated SPLOOP Instruction
– Compact Instructions (16-Bit)
– Instruction Set Enhancements
– Exception Handling
– L1/L2 Memory Architecture:
• 256K-Bit (32K-Byte) L1P Program
RAM/Cache [Direct Mapped, Flexible
Allocation]
• 256K-Bit (32K-Byte) L1D RAM/Cache
[2-Way Set-Associative, Flexible
Allocation]
• 4.75M-Bit (608K-Byte) L2 Unified Mapped
RAM/Cache [4-Way Set-Associative,
Flexible Allocation]
• L1P Memory Controller
• L1D Memory Controller
• L2 Memory Controller
– Time Stamp Counter
– One 64-Bit General-Purpose/Watchdog Timer
• Shared Peripherals and Interfaces
– EDMA Controller
(64 Independent Channels)
– Shared Memory Architecture
• Shared L2 Memory Controller
• 768K-Byte of RAM
• Boot ROM
– Three Telecom Serial Interface Ports (TSIPs)
• Each TSIP is 8 Links of 8 Mbps per
Direction
– 32-Bit DDR2 Memory Controller (DDR2-533
SDRAM)
• 256 M-Byte x 2 Addressable Memory
Space
– Two 1x Serial RapidIO® Links,
v1.2 Compliant
• 1.25-, 2.5-, 3.125-Gbps Link Rates
• Message Passing, DirectIO Support,
Error Management Extensions, and
Congestion Control
• IEEE 1149.6 Compliant I/Os
– UTOPIA
• UTOPIA Level 2 Slave ATM Controller
• 8/16-Bit Transmit and Receive
Operations up to 50 MHz per Direction
• User-Defined Cell Format up to 64 Bytes
– Two 10/100/1000 Mb/s Ethernet MACs
(EMACs)
• Both EMACs are IEEE 802.3 Compliant
• EMAC0 Supports:
– MII, RMII, SS-SMII, GMII, and RGMII
– 8 Independent Transmit (TX)
Channels
– 8 Independent Receive (RX)
Channels
• EMAC1 Supports:
– RMII, SS-SMII and RGMII
– 8 Independent Transmit (TX)
Channels
– 8 Independent Receive (RX)
Channels
• Both EMACs (EMAC0 and EMAC1) Share
MDIO Interface
– 16-Bit Host-Port Interface (HPI)
– One Inter-Integrated Circuit (I2C) Bus
– Six Shared 64-Bit General-Purpose Timers
• System PLL and PLL Controller
• Secondary PLL and PLL Controller, Dedicated
to EMAC
• Third PLL and PLL Controller Dedicated to
DDR2 Memory Controller
• 16 General-Purpose I/O (GPIO) Pins
• IEEE-1149.1 (JTAG™)
Boundary-Scan-Compatible
• 737-Pin Ball Grid Array (BGA) Package
(CTZ, GTZ or ZTZ Suffix), 0.8-mm Ball Pitch
• 0.09-μm/7-Level Cu Metal Process (CMOS)
• 3.3-, 1.8-, 1.5-, 1.2-V I/O Supplies
• 1.0-/1.1-, 1.2-V Core Supplies
• Commercial Temperature [0°C to 85°C]
• Extended High Temperature [0°C to 100°C]
• Extended Low Temperature [-40°C to 85°C]
• Extended Temperature [-40°C to 100°C]
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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