MSP430F543X_10 Datasheet, PDF (94/99 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2010
Orderable Device
MSP430F5438AIZQWR
MSP430F5438AIZQWT
MSP430F5438IPN
MSP430F5438IPZ
Status ^{(1) Package Type Package}
Drawing
ACTIVE
BGA
MICROSTAR
JUNIOR
ACTIVE
BGA
MICROSTAR
JUNIOR
OBSOLETE LQFP
ACTIVE
LQFP
ZQW
ZQW
PN
PZ
Pins
113
113
80
100
Package Qty
2500
250
90
MSP430F5438IPZR
ACTIVE
LQFP
PZ
100
1000
XMS430F5438AIPZ
XMS430F5438AIPZR
PREVIEW
PREVIEW
LQFP
LQFP
PZ
100
PZ
100
90
1000
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
Call TI Call TI
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
Call TI
Call TI
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
Request Free Samples
Purchase Samples
Samples Not Available
Contact TI Distributor
or Sales Office
Request Free Samples
Samples Not Available
Samples Not Available
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3