DRV8824-Q1_15 Datasheet, PDF (5/30 Pages) Texas Instruments – DRV8824-Q1 Automotive Motor Controller IC

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DRV8824-Q1
SLVSCH0 – APRIL 2014
7.4 Thermal Information
DRV8824-Q1
THERMAL METRIC
PWP
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance⁽¹⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance⁽³⁾
Junction-to-top characterization parameter⁽⁴⁾
Junction-to-board characterization parameter⁽⁵⁾
Junction-to-case (bottom) thermal resistance⁽⁶⁾
28 TERMINAL
38.9
23.3
21.2
0.8
20.9
2.6
°C/W
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(5) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA , using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
7.5 Electrical Characteristics
over operating free-air temperature range of -40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
POWER SUPPLIES
I_VM
VM operating supply current
I_VMQ
VM sleep mode supply current
V_UVLO
VM undervoltage lockout voltage
V3P3OUT REGULATOR
V_M = 24 V, f_PWM < 50 kHz
V_M = 24 V
V_M rising
V_3P3
V3P3OUT voltage
IOUT = 0 to 1 mA, V_M = 24 V, T_J = 25°C
IOUT = 0 to 1 mA
3.18
3.10
LOGIC-LEVEL INPUTS
V_IL
Input low voltage
V_IH
Input high voltage
2
V_HYS
Input hysteresis
I_IL
Input low current
VIN = 0
–20
I_IH
Input high current
VIN = 3.3 V
nENBL, nRESET, DIR, STEP, MODEx
R_PD
Internal pulldown resistance
nSLEEP
nHOME, nFAULT OUTPUTS (OPEN-DRAIN OUTPUTS)
V_OL
Output low voltage
I_OH
Output high leakage current
DECAY INPUT
I_O = 5 mA
V_O = 3.3 V
V_IL
Input low threshold voltage
For slow decay mode
V_IH
Input high threshold voltage
For fast decay mode
I_IN
Input current
R_PU
Internal pullup resistance
R_PD
Internal pulldown resistance
2
–100
TYP
MAX UNIT
5
8 mA
10
20
μA
7.8
8.2
V
3.30
3.45
V
3.30
3.50
0.6
0.7
V
5.25
V
0.45
V
20
μA
100
μA
100
kΩ
1
MΩ
0.5
V
1
μA
0.8
V
V
100
µA
130
kΩ
80
kΩ
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