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DRV595 Datasheet, PDF (4/24 Pages) Texas Instruments – 15V/±3A High-Efficiency PWM Power Driver
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DRV595
SLOS808 – DECEMBER 2012
PIN
NO.
NAME
26, 30 BSP
27
OUTP
28
GND
29
OUTP
31, 32 PVCC
33
Thermal
Pad or
PowerPAD
™
TYPE
BST
PO
G
PO
P
G
Pin Functions (continued)
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DESCRIPTION
Boot strap for positive output, connect to 220 nF X5R, or better ceramic cap to OUTP
Positive output
Ground
Positive output
Power supply
Connect to GND for best system performance. If not connected to GND, leave floating.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage, VCC
PVCC, AVCC
IN+, IN–
Input voltage, VI
Slew rate, maximum(2)
GAIN / SLV, SYNC
SDZ, MODSEL
FS0, FS1, FS2, HI-Z, SDZ, MODSEL
Operating free-air temperature, TA
Operating junction temperature range, TJ
Storage temperature range, Tstg
Electrostatic discharge: Human body model, ESD
Electrostatic discharge: Charged device model, ESD
VALUE
–0.3 to 30
–0.3 to 6.3
–0.3 to GVDD+0.3
–0.3 to PVCC+0.3
10
–40 to 85
–40 to 150
–40 to 125
±2
±500
UNIT
V
V
V
V
V/msec
°C
°C
°C
kV
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) 100 kΩ series resistor is needed if maximum slew rate is exceeded.
THERMAL INFORMATION
THERMAL METRIC(1)
θJA
Junction-to-ambient thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
DRV595
DAP
2 Layer PCB(2)
32 PINS
22
0.3
4.8
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For the PCB layout please see the DRV595EVM user guide.
4
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