THS6204 Datasheet, PDF (30/43 Pages) Texas Instruments – Dual-Port, Differential VDSL2 Line Driver Amplifiers

THS6204
SBOS416C – OCTOBER 2007 – REVISED APRIL 2009 ................................................................................................................................................... www.ti.com
POWER CONTROL OPERATION
The THS6204 provides a power control feature that
may be used to reduce system power. The four
modes of operation for this power control feature are
full-power, power cutback, idle state, and power
shutdown. These four operating modes are set
through two logic lines A0 and A1. Table 4 shows the
different modes of operation.
Table 4. Power Control Mode of Operation
MODE OF
OPERATION
Full bias mode
Mid bias mode
Low bias mode
Shutdown
BIAS 1
0
1
0
1
BIAS 2
0
0
1
1
The full-power mode is used for normal operating
condition. The power cutback mode brings the
quiescent power to 13.5mA. The idle state mode
keeps a low output impedance but reduces output
power and bandwidth. The shutdown mode has a
high output impedance as well as the lowest
quiescent power (0.5mA).
If the Bias 1 and Bias 2 pins are left unconnected, the
THS6204 shuts down.
DEVICE PROTECTION FEATURE
The THS6204 has a built-in thermal protection
feature. Should the internal junction temperature rise
above approximately +160°C, the device
automatically shuts down. Such a condition could
exist with improper heat sinking or if the output is
shorted to ground. When the abnormal condition is
fixed, the internal thermal shutdown circuit
automatically turns the device back on. This occurs at
approximately +145°C, junction temperature. Note
that the THS6204 does not have short-circuit
protection and care should be taken to minimize the
output current below the absolute maximum ratings.
THERMAL INFORMATION
The THS6204 is available in thermally-enhanced
RHF and PWP packages, which are members of the
PowerPAD family of packages. These packages are
constructed using leadframes upon which the dies
are mounted (see Figure 88 for the RHF package and
Figure 89 for the PWP package). This arrangement
results in the lead frames being exposed as thermal
pads on the underside of their respective packages.
Because a thermal pad has direct thermal contact
with the die, excellent thermal performance can be
achieved by providing a good thermal path away from
the thermal pad. Note that the PowerPAD is
electronically isolated from the active circuitry and
any pins. Thus, the PowerPAD can be connected to
any potential voltage within the absolute maximum
voltage range. Ideally, connection of the PAD to the
most negative supply plane is preferred.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package into either a ground plane or other heat
dissipating device. This is discussed in more detail in
the PCB design considerations section of this
document.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
(1) The thermal pad is electrically isolated from all terminals in the package.
Figure 88. Views of Thermally-Enhanced RHF Package (Representative Only—Not to Scale)
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