THS6204 Datasheet, PDF (2/43 Pages) Texas Instruments – Dual-Port, Differential VDSL2 Line Driver Amplifiers

THS6204
SBOS416C – OCTOBER 2007 – REVISED APRIL 2009 ................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
PRODUCT ⁽²⁾
THS6204IRHFT
THS6204IRHFR
THS6204IPWP
THS6204IPWPR
PACKAGE-LEAD
QFN-24
TSSOP-24
PACKAGE
DESIGNATOR
RHF
PWP
PACKAGE MARKING
6204
THS6204
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
Rails, 60
Tape and Reel, 2000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The PowerPAD is electrically isolated from all other pins.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage, V_S– to V_S+
Input voltage, V_I
Differential input voltage, V_ID
Output current, I_O—static dc⁽²⁾
Continuous power dissipation
Maximum junction temperature, any condition, T_J(3)
Maximum junction temperature, continuous operation, long-term reliability, T_J(4), QFN
package
Maximum junction temperature, continuous operation, long-term reliability, T_J(4), TSSOP
package
Storage temperature range, T_STG
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Human body model (HBM)
ESD ratings
Charged device model (CDM)
Machine model (MM)
THS6204
UNIT
28
V
±V_S
±2
V
±100
mA
See Dissipation Ratings table
+150
°C
+130
°C
+140
°C
–65 to +150
°C
+300
°C
2000
V
500
V
100
V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The THS6204 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally-enhanced package. Under high-frequency ac operation (> 10kHz), the short-term output current capability is much greater
than the continuous dc output current rating. This short-term output current rating is about 8.5X the dc capability, or about ±850mA.
(3) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(4) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
2
Submit Documentation Feedback
Product Folder Link(s): THS6204
Copyright © 2007–2009, Texas Instruments Incorporated