TLC5970 Datasheet, PDF (3/48 Pages) Texas Instruments – 3-Channel, 12-Bit, PWM LED Driver with Buck DC/DC Converter and Differential Signal Interface

TLC5970
www.ti.com
SBVS140 – MARCH 2010
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
TLC5970
RHP
UNITS
q_JA
q_JC(top)
q_JB
y_JT
y_JB
q_JC(bottom)
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case(top) thermal resistance ⁽³⁾
Junction-to-board thermal resistance ⁽⁴⁾
Junction-to-top characterization parameter ⁽⁵⁾
Junction-to-board characterization parameter ⁽⁶⁾
Junction-to-case(bottom) thermal resistance ⁽⁷⁾
28
26.7
11.7
5.3
°C/W
0.4
5.2
1.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, y_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, y_JB estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
DISSIPATION RATINGS
PACKAGE
HTSSOP-32
with PowerPAD soldered⁽¹⁾⁽²⁾
HTSSOP-32
with PowerPAD unsoldered⁽²⁾⁽³⁾
QFN-28
bottom side heat sink soldered⁽⁴⁾
DERATING FACTOR
ABOVE T_A = +25°C
42.5 mW/°C
POWER RATING
T_A < +25°C
5318 mW
22.5 mW/°C
2820 mW
33.2 mW/°C
4149 mW
POWER RATING
T_A = +70°C
3403 mW
1805 mW
2655 mW
POWER RATING
T_A = +85°C
2765 mW
1466 mW
2157 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2-oz. copper. For more information, see application report
SLMA002, PowerPAD Thermally-Enhanced Package (available for download at www.ti.com).
(2) Product preview device.
(3) With PowerPAD not soldered onto copper area on PCB.
(4) The package thermal impedance is calculated in accordance with JESD51-5.
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLC5970
Submit Documentation Feedback
3