TLC254 Datasheet, PDF (3/21 Pages) Texas Instruments – LinCMOSE QUAD OPERATIONAL AMPLIFIERS

TLC254, TLC254A, TLC254B, TLC254Y, TLC25L4, TLC25L4A, TLC25L4B
TLC25L4Y, TLC25M4, TLC25M4A, TLC25M4B, TLC25M4Y
LinCMOS™ QUAD OPERATIONAL AMPLIFIERS
SLOS003F – JUNE 1983 – REVISED AUGUST 1994
chip information
These chips, when properly assembled, display characteristics similar to the TLC25_4C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(13)
(12) (11) (10)
(9)
68
VDD
(4)
(3)
1IN +
+
(1)
(2)
1OUT
1IN –
–
(8)
(7)
+ ⁽⁵⁾ _{2IN +}
2OUT
3IN +
(10)
+
(6)
–
(8)
2IN –
(9)
3IN –
–
3OUT
(14)
4OUT
+ ⁽¹²⁾
(13)
–
4IN +
4IN –
(11)
VDD– /GND
(1)
(2)
(3)
(4) (5)
(6)
(7)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
108
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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