BQ24030_07 Datasheet, PDF (29/38 Pages) Texas Instruments – SINGLE-CHIP CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC (bqTINY)

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PACKAGE OPTION ADDENDUM
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
BQ24030RHLR
BQ24030RHLRG4
BQ24031RHLR
BQ24031RHLRG4
BQ24031RHLT
BQ24031RHLTG4
BQ24032ARHLR
BQ24032ARHLRG4
BQ24032ARHLT
BQ24032ARHLTG4
BQ24035RHLR
BQ24035RHLRG4
BQ24038RHLR
BQ24038RHLRG4
BQ24038RHLT
BQ24038RHLTG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
QFN
Package
Drawing
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
QFN
RHL
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1