DRV401_15 Datasheet, PDF (26/36 Pages) Texas Instruments – Sensor Signal Conditioning IC for Closed-Loop Magnetic Current Sensor

PACKAGE OPTION ADDENDUM
www.ti.com
9-Sep-2014
PACKAGING INFORMATION
Orderable Device
DRV401AIDWP
DRV401AIDWPG4
DRV401AIDWPR
DRV401AIDWPRG4
DRV401AIRGWR
DRV401AIRGWRG4
DRV401AIRGWT
DRV401AIRGWTG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE SO PowerPAD DWP 20
25 Green (RoHS
& no Sb/Br)
ACTIVE SO PowerPAD DWP 20
25 Green (RoHS
& no Sb/Br)
ACTIVE SO PowerPAD DWP 20 1000 Green (RoHS
& no Sb/Br)
ACTIVE SO PowerPAD DWP 20 1000 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGW 20 3000 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGW 20 3000 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGW 20
250 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGW 20
250 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
DRV401A
DRV401A
DRV401A
DRV401A
HAAQ
HAAQ
HAAQ
HAAQ
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1