DRV401_15 Datasheet, PDF (2/36 Pages) Texas Instruments – Sensor Signal Conditioning IC for Closed-Loop Magnetic Current Sensor

DRV401
SBVS070B − JUNE 2006 − REVISED MAY 2009
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Input Terminals:
Voltage⁽²⁾ . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to V_DD + 0.5V
Differential Amplifier⁽³⁾ . . . . . . . . . . . . . . . . . . . . . . −10V to +10V
Current at IS1 and IS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75mA
Current (pins other than IS1 and IS2)⁽²⁾ . . . . . . . . . . . . . . ±25mA
I_COMP Short Circuit⁽⁴⁾ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +250mA
Operating Junction Temperature . . . . . . . . . . . . . −50°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −55°C to +150°C
ESD Rating:
Human Body Model (HBM)
Pins IA_IN1 and IA_IN2 Only . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV
(1) _{Stresses above these ratings may cause permanent damage.}
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) _{Input terminals are diode-clamped to the power-supply rails.}
Input signals that can swing more than 0.5V beyond the supply
rails must be current limited, except for the differential amplifier
input pins.
(3) _{These inputs are not internally protected against over voltage.}
The differential amplifier input pins must be limited to 5mA, max or
±10V, max.
(4) _{Power-limited; observe maximum junction temperature.}
www.ti.com
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD _{DESIGNATOR MARKING}
DRV401
QFN-20
(5mm x 5mm)
RGW
HAAQ
DRV401
SO-20
DWP
DRV401A
(1) _{For the most current package and ordering information see the}
Package Option Addendum at the end of this document, or see
the TI web site at www.ti.com.
2