AM1810 Datasheet, PDF (256/259 Pages) Texas Instruments – AM1810 ARM Microprocessor For PROFIBUS

AM1810
SPRS709B – NOVEMBER 2010 – REVISED DECEMBER 2011
www.ti.com
7 Mechanical Packaging and Orderable Information
This section describes the device orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
7.1 Thermal Data for ZWT Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
1
RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
°C/W ⁽¹⁾
7.3
12.4
23.7
21.0
20.1
19.3
18.4
0.2
0.3
0.3
0.4
0.5
12.3
12.2
12.1
12.0
11.9
AIR FLOW (m/s)⁽²⁾
N/A
N /A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) m/s = meters per second
256 Mechanical Packaging and Orderable Information
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM1810