THS7319 Datasheet, PDF (25/34 Pages) Texas Instruments – 3-Channel, Very Low Power Video Amplifiers with EDTV Filters and 6-dB Gain

THS7319
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
Solder Paste
TI recommends using a Type 3 or finer solder paste
when mounting the MicrostarCSP. This paste offers
the following advantages:
• It acts as a flux to aid wetting of the solder ball to
the PCB land.
• The adhesive properties of the paste hold the
component in place during the reflow process.
• Solder paste selection is normally driven by the
overall system-assembly requirements. In general,
the no clean compositions are preferred because
of the difficulty in cleaning below the mounted
components. Customers should check with the
solder-paste vendors regarding electrical issues
from residues left on the board.
TI recommends a pressure safety zone in mounting
the MicrostarCSP package. The recommended force
should be controlled to 5N maximum for static and
2.5N for impact.
Maximum 235°C, Minimum 195°C
183
165
135
Minimum 60s
Maximum 120s
Minimum 30s
Maximum 90s
Time
Figure 55. SnPb Temperature Profile Example
Maximum 260°C, Minimum 230°C
220
EXAMPLE REFLOW PROFILE
The MicrostarCSP package solder ball is compatible
with lead and lead-free pastes. Example reflow
profiles for SnPb and Pb-free are shown in Figure 55
and Figure 56. Table 4 lists the profiles for SnPb and
Pb-free reflow.
TI recommends that the solder-paste manufacturer
temperature profile be used to optimize flux activity
within the MSL guidelines for the most
thermally-sensitive component. Refer to J-STD-033
for more details on the MSL classification.
180
150
Minimum 60s
Maximum 120s
Minimum 30s
Maximum 90s
Time
Figure 56. Pb-Free Temperature Profile Example
Table 4. SnPb and Pb-Free Example Reflow Profiles
PARAMETER
Ramp rate
Preheat
Time above liquids
Peak temperature
Time within 5°C peak temperature
Ramp down rate
SnPb
3°C/second, maximum
135°C to 165°C
60 to 120 seconds
183°C
30 to 90 seconds
235°C
10 to 20 seconds
6°C/second, maximum
Pb-FREE
3°C/second, maximum
150°C to 180°C
60 to 120 seconds
220°C
30 to 90 seconds
260°C +0/–5°C
10 to 20 seconds
6°C/second, maximum
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