TMS320C6678_15 Datasheet, PDF (241/248 Pages) Texas Instruments – Multicore Fixed and Floating-Point Digital Signal Processor

TMS320C6678
Multicore Fixed and Floating-Point Digital Signal Processor
SPRS691E—March 2014
9 Mechanical Data
9.1 Thermal Data
Table 9-1 shows the thermal resistance characteristics for the CYP PBGA 841-pin package with Pb-free die bumps
and Pb-free solder balls.
Table 9-1
Thermal Resistance Characteristics for CYP (PBGA 841-Pin Package)
No.
1 R_JC
2 R_JB
End of Table 9-1
Junction-to-case
Junction-to-board
°C/W
0.18
3.71
Table 9-2 shows the thermal resistance characteristics for the GYP PBGA 841-pin package with Pb-free die bumps
and Pb-based solder balls.
Table 9-2
Thermal Resistance Characteristics for GYP (PBGA 841-Pin Package)
No.
1 R_JC
2 R_JB
End of Table 9-2
Junction-to-case
Junction-to-board
°C/W
0.18
3.71
9.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
Copyright 2014 Texas Instruments Incorporated
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Mechanical Data 241