THS6182_07 Datasheet, PDF (24/35 Pages) Texas Instruments – LOW-POWER DISSIPATION ADSL LINE DRIVER

www.ti.com
PACKAGE OPTION ADDENDUM
11-Dec-2006
PACKAGING INFORMATION
Orderable Device
THS6182D
THS6182DG4
THS6182DR
THS6182DRG4
THS6182DW
THS6182DWG4
THS6182DWP
THS6182DWPG4
THS6182DWPR
THS6182DWPRG4
THS6182DWR
THS6182DWRG4
THS6182RHFR
THS6182RHFRG4
THS6182RHFT
THS6182RHFTG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
Package
Drawing
D
SOIC
D
SOIC
D
SOIC
D
SOIC
DW
SOIC
DW
SO
Power
PAD
SO
Power
PAD
SO
Power
PAD
SO
Power
PAD
SOIC
DWP
DWP
DWP
DWP
DW
SOIC
DW
QFN
RHF
QFN
RHF
QFN
RHF
QFN
RHF
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
24 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
24 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
24 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 1