THS6182_07 Datasheet, PDF (2/35 Pages) Texas Instruments – LOW-POWER DISSIPATION ADSL LINE DRIVER

THS6182
SLLS544G – SEPTEMBER 2002 – REVISED NOVEMBER 2004
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
PRODUCT
THS6182RHF
THS6182D
THS6182DW
THS6182DWP
PACKAGE
ORDERING INFORMATION
PACKAGE CODE SYMBOL
Leadless 24-pin
4, mm x 5, mm PowerPAD™
RHF-24
6182
SOIC-16
D-16
THS6182
SOIC-20
DW-20
THS6182
SOIC-20 PowerPAD
DWP-20
THS6182
ORDER NUMBER
THS6182RHFR
THS6182RHFT
THS6182D
THS6832DR
THS6182DW
THS6182DWR
THS6182DWP
THS6182DWPR
TRANSPORT MEDIA
Tape and reel
(3000 devices)
Tape and reel
(250 devices)
Tube (40 devices)
Tape and reel
(2500 devices)
Tube (25 devices)
Tape and reel
(2000 devices)
Tube (25 devices)
Tape and reel
(2000 devices)
PACKAGE DISSIPATION RATINGS⁽¹⁾
PACKAGE
RHF-24 ⁽²⁾
D-16
DW-20
DWP-20 ⁽²⁾
PowerPAD SOLDERED⁽²⁾
θ_JA
32°C/W
--
--
21.5°C/W
PowerPAD NOT SOLDERED⁽³⁾
θ_JC
74°C/W
62.9°C/W
45.4°C/W
43.9°C/W
θ_JC
1.7°C/W
25.7°C/W
16.4°C/W
0.37°C/W
(1) θ_JA values shown are typical for standard test PCBs only.
(2) For high-power dissipation applications, use of the PowerPAD package with the PowerPad on the underside of the chip. This acts as a
heatsink and must be connected to a thermally dissipating plane for proper dissipation. Failure to do so may result in exceeding the
maximum junction temperature which could permanently damage and/or reduce the lifetime the device. See TI technical brief SLMA002
for more information about utilizing the PowerPAD thermally enhanced package.
(3) Use of packages without the PowerPAD or not soldering the PowerPAD to the PCB, should be limited to low-power dissipation
applications.
RECOMMENDED OPERATING CONDITIONS
V_CC+to V_CC- Supply voltage
Dual supply
Single supply
MIN NOM MAX UNIT
±5 ±12 ±15
V
10 24 30
2