THS6182_07 Datasheet, PDF (20/35 Pages) Texas Instruments – LOW-POWER DISSIPATION ADSL LINE DRIVER

THS6182
SLLS544G – SEPTEMBER 2002 – REVISED NOVEMBER 2004
www.ti.com
APPLICATION INFORMATION (continued)
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
However, in this application, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the THS6182 package should make their connection to the internal ground plane with a
complete connection around the entire circumference of the plated through hole.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area with
its five holes. The four larger holes outside the thermal pad area, but still under the package, should be
covered with solder mask.
7. Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals.
8. With these preparatory steps in place, the THS6182 DWP is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
0.476
0.120
0.080
0.1025
0.026
0.024
0.085
0.178
0.450
0.0165
.039
0.021
PowerPAD and via placement
pad area (0.085 x 0.120) with 15
vias (Via diameter = 0.013)
0.026
Vias should go through the board connecting the top layer
PowerPad to any and all ground planes. (The larger the ground
plane, the larger the area to distribute the heat.) Solder resist should
be used on the bottom side ground plane in order to prevent wicking
of the solder through the vias during the reflow process.
All Units in Inches
Figure 73. 20-Pin DWP PowerPAD PCB Etch and Via Pattern
The RHF package is similar to the DWP package with respect to PCB mounting procedures. The recommended
PCB layout is as shown in Figure 74.
20