THS3061 Datasheet, PDF (24/25 Pages) Texas Instruments – LOW DISTORTION HIGH SLEW RATE CURRENT FREEBACK AMPLIFIERS

THS3061
THS3062
SLOS394A – JULY 2002 – OCTOBER 2002
DGN (S-PDSO-G8)
www.ti.com
MECHANICAL INFORMATION
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
0,65
8
0,38
0,25
5
0,25 M
3,05 4,98
2,95 4,78
Thermal Pad
(See Note D)
0,15 NOM
1
4
3,05
2,95
Gage Plane
0°–ā6°
0,25
0,69
0,41
1,07 MAX
0,15
0,05
Seating Plane
0,10
4073271/A 01/98
NOTES:A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and
thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments.
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