THS3061 Datasheet, PDF (2/25 Pages) Texas Instruments – LOW DISTORTION HIGH SLEW RATE CURRENT FREEBACK AMPLIFIERS

THS3061
THS3062
SLOS394A – JULY 2002 – OCTOBER 2002
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
Supply voltage, V_S±
Input voltage, V_I
Output current, I_O
Differential input voltage, V_ID
Continuous power dissipation
16.5 V
±V_S
200 mA
±3 V
See Dissipation Rating Table
Maximum junction temperature, T_J
Operating free-air temperature range, T_A
Storage temperature range, T_stg
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
150°C
–40°C to 85°C
–65°C to 150°C
300°C
(1) _{Stresses above these ratings may cause permanent damage.}
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) _{The THS306x may incorporate a PowerPAD on the underside of}
the chip. This acts as a heatsink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI
technical brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
PACKAGE
D(8 pin)(1)
θ_JC
(°C/W)
38.3
θ_JA
(°C/W)
95
POWER RATING
(TJ = 125°C)
TA ≤ 25°C TA = 85°C
1.05 W
0.42 W
DDA (8 pin)
9.2
45.8
2.18 W
0.87 W
DGN (8 pin)(2)
4.7
58.4
1.71 W
0.68 W
(1) _{This data was taken using the JEDEC High-K test PCB. For the}
JEDEC Low-K test PCB, θ_JA is 167°C/W with power rating at
TA = 25°C of 0.6 W.
(2) _{This data was taken using 2 oz. trace and copper pad that is}
soldered directly to a 3 in. x 3 in. PCB.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Supply voltage
Dual supply
±5
±15
V
Single supply 10
30
Operating free-air temperature, T_A
–40 85 °C
PACKAGE/ORDERING INFORMATION
NUMBER OF CHANNELS
PLASTIC SOIC-8(1)
(D)
ORDERABLE PACKAGE AND NUMBER
(OPERATING RANGE FROM –40°C TO 85°C)
PLASTIC SOIC-8(1)
PowerPAD (DDA)
PLASTIC MSOP-8(1)
PowerPAD (DGN)
PACKAGE MARKING
1
THS3061D
—
THS3061DGN
BIB
2
THS3062D
THS3062DDA
THS3062DGN
BIC
(1) _{This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., THS3062DGNR).}
PIN ASSIGNMENTS
TOP VIEW
D, DGN
THS3061
NC
1
8
NC
V_IN–
2
7
V_S+
V_IN+
3
6
V^OUT
V_S–
4
5
NC
NC – No internal connection
TOP VIEW
1V_OUT
1V_IN–
1V_IN+
V_S–
THS3062
1
8
2
7
3
6
4
5
D, DDA, DGN
V_S+
2V_OUT
2V_IN–
2_VIN+
2