THS3061 Datasheet, PDF (14/25 Pages) Texas Instruments – LOW DISTORTION HIGH SLEW RATE CURRENT FREEBACK AMPLIFIERS

THS3061
THS3062
SLOS394A – JULY 2002 – OCTOBER 2002
www.ti.com
+12 V
THS3062(a)
VI+
+
_
0.1 µF
+
10 µF
499 Ω
0.1 µF
210 Ω
RS
RLine
2n2
1:n
Telephone Line
RLine
THS3062(b)
VI–
+
_
499 Ω
–12 V
0.1 µF
10 µF
+
RS
RLine
2n2
Figure 48. Simple Line Driver With THS3062
Due to the large power supply voltages and the large current drive capability, power dissipation of the amplifier must
not be neglected. To have as much power dissipation as possible in a small package, the THS3062 is available only
in a MSOP–8 PowerPAD package (DGN) and an even lower thermal impedance SOIC–8 PowerPAD package
(DDA). The thermal impedance of a standard SOIC package is too large to allow for useful applications with up to
30 V across the power supply terminals with this dual amplifier. But, the THS3061 – a single amplifier, can be utilized
in the standard SOIC package. Again, power dissipation of the amplifier must be carefully examined or else the
amplifiers could become too hot and performance can be severely degraded. See the Power Dissipation and Thermal
Considerations section for more information on thermal management.
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