THS3061 Datasheet, PDF (17/25 Pages) Texas Instruments – LOW DISTORTION HIGH SLEW RATE CURRENT FREEBACK AMPLIFIERS

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THS3061
THS3062
SLOS394A – JULY 2002 – OCTOBER 2002
PowerPAD DESIGN CONSIDERATIONS
The THS306x family is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 50(a) and Figure 50(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 50(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance can
be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During
the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a
copper area underneath the package. Through the use of thermal paths within this copper area, heat can be
conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of surface
mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Figure 50. Views of Thermally Enhanced Package
Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the
recommended approach.
ÓÓÓÓÓÓÓ _{68 Mils x 70 Mils}
ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ (Via diameter= 10 mils)
Figure 51. DGN PowerPAD PCB Etch and Via Pattern
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