THS3061 Datasheet, PDF (23/25 Pages) Texas Instruments – LOW DISTORTION HIGH SLEW RATE CURRENT FREEBACK AMPLIFIERS

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DDA (S–PDSO–G8)
THS3061
THS3062
SLOS394A – JULY 2002 – OCTOBER 2002
MECHANICAL INFORMATION
Power PADt PLASTIC SMALL-OUTLINE
1,27
8
0,49
0,35
5
0,10 M
3,99 6,20
3,81 5,84
1
4
4,98
4,80
1,68 MAX
Thermal Pad
(See Note D)
0,20 NOM
Gage Plane
0°–8°
Seating Plane
1,55
0,10
0,13
1,40
0,03
0,25
0,89
0,41
4202561/A 02/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
PowerPAD is a trademark of Texas Instruments.
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