MSP430X15X Datasheet, PDF (24/73 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430x15x, MSP430x16x, MSP430x161x
MIXED SIGNAL MICROCONTROLLER
SLAS368E − OCTOBER 2002 − REVISED AUGUST 2006
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Voltage applied at V_CC to V_SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4.1 V
Voltage applied to any pin (see Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V_CC + 0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature, T_stg: (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
(programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V_SS. The JTAG fuse-blow voltage, V_FB, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TDI/TCLK pin when blowing the JTAG fuse.
recommended operating conditions
MIN NOM
MAX UNITS
Supply voltage during program execution,
V_CC (AV_CC = DV_CC = V_CC)
MSP430F15x/16x/
161x
1.8
Supply voltage during flash memory programming, V_CC
(AV_CC = DV_CC = V_CC)
MSP430F15x/16x/
161x
2.7
Supply voltage during program execution, SVS enabled (see
Note 1), V_CC (AV_CC = DV_CC = V_CC)
MSP430F15x/16x/
161x
2
Supply voltage, V_SS (AV_SS = DV_SS = V_SS)
0
Operating free-air temperature range, T_A
MSP430F15x/16x/
161x
−40
3.6 V
3.6 V
3.6 V
0V
85 °C
LFXT1 crystal frequency, f_(LFXT1)
(see Notes 2 and 3)
LF selected, XTS=0 Watch crystal
XT1 selected, XTS=1 Ceramic resonator
XT1 selected, XTS=1 Crystal
450
1000
32.768
kHz
8000 kHz
8000 kHz
XT2 crystal frequency, f_(XT2)
Ceramic resonator
Crystal
450
1000
8000
kHz
8000
Processor frequency (signal MCLK), f_(System)
V_CC = 1.8 V
DC
V_CC = 3.6 V
DC
4.15
MHz
8
NOTES: 1. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the V_CC is raised above the minimum supply voltage plus the hysteresis of the SVS circuitry.
2. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1MΩ resistor from XOUT to V_SS is recommended when V_CC <
2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15MHz at V_CC ≥ 2.2 V. In XT1 mode,
the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8MHz at V_CC ≥ 2.8 V.
3. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
f (MHz)
ÎÎÎÎÎÎÎÎÎÎ ^{8.0 MHz}
Supply voltage range,
’F15x/16x/161x, during
program execution
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ _{4.15 MHz}
Supply voltage range,
’F15x/16x/161x,
during flash memory programming
1.8 V
2.7 V 3 V
3.6 V
Supply Voltage − V
Figure 1. Frequency vs Supply Voltage, MSP430F15x/16x/161x
24
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