THS8133_07 Datasheet, PDF (20/25 Pages) Texas Instruments – TRIPLE 10-BIT, 80 MSPS VIDEO D/A CONVERTER WITH TRI-LEVEL SYNC GENERATION WITH TRI-LEVEL SYNC GENERATION

THS8133, THS8133A, THS8133B
TRIPLE 10ĆBIT, 80 MSPS VIDEO D/A CONVERTER
WITH TRIĆLEVEL SYNC GENERATION
SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000
designing with PowerPAD (continued)
For the THS8133 this thermal land should be grounded to the low impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
should be as large as possible without shorting device signal terminals. The thermal land may be soldered to
the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device.
Table 11 lists a comparison for thermal resistances between the PowerPAD package (48PHP) used for this
device and a regular 48-pin TQFP package (48PFB).
Table 11. Junction-Ambient and Junction-Case Thermal Resistances
48PHP PowerPAD vs 48PFB
REGULAR TQFP
θ_JA (°C/W) 48PHP
θ_JC (°C/W) 48PHP
θ_JA (°C/W) 48PFB
θ_JC (°C/W) 48PFB
AIRFLOW IN lfm
0
150 250 500
29.1 23.1 21.6 19.9
1.14
97.5 78.3 71.6 63.5
19.6
20
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