LPV521MGX Datasheet, PDF (2/29 Pages) Texas Instruments – LPV521 Nanopower, 1.8V, RRIO, CMOS Input, Operational Amplifier

LPV521
SNOSB14C – AUGUST 2009 – REVISED FEBRUARY 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance⁽³⁾
Human Body Model
Machine Model
Any pin relative to V^-
Charge-Device Model
IN+, IN-, OUT Pins
V⁺, V^-, OUT Pins
Differential Input Voltage (V_IN+ - V_IN-)
Storage Temperature Range
Junction Temperature⁽⁴⁾
Mounting Temperature
Infrared or Convection (30 sec.)
Wave Soldering Lead Temp. (4 sec.)
2000V
200V
1000V
6V, −0.3V
V⁺ + 0.3V, V^– – 0.3V
40mA
±300 mV
−65°C to 150°C
150°C
260°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the
Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings⁽¹⁾
Temperature Range⁽²⁾
Supply Voltage (V_S = V⁺ - V^−)
Package Thermal Resistance (θ_JA)⁽²⁾
5-Pin SC70
−40°C to 125°C
1.6V to 5.5V
456 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the
Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
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