LMH6518_15 Datasheet, PDF (2/41 Pages) Texas Instruments – LMH6518 900 MHz, Digitally Controlled, Variable Gain Amplifier

LMH6518
SNOSB21C – MAY 2008 – REVISED JULY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Charge Device Model
Supply Voltage
V_CC (5V nominal)
V_DD (3.3V nominal)
Differential Input
Input Common Mode Voltage
V_CM and V_{CM_Aux}
SPI Inputs
Maximum Junction Temperature
Storage Temperature Range
Soldering Information
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
2000V
200V
1000V
5.5V
3.6V
±1V
1V to 4V
2V
3.6V
150°C
−65°C to 150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Operating Ratings ⁽¹⁾
Supply Voltage
Temperature Range
V_CC = 5V (±5%)
V_DD = 3.3V (±5%)
−40°C to 85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
Thermal Properties
Temperature Range ⁽¹⁾
−40°C to 85°C
Junction-to-Ambient
Thermal Resistance (θJ_A), WQFN ⁽¹⁾
40°C/W
(1) The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
Package should be soldered unto a 6.8 mm² copper area as shown in the “recommended land pattern” shown in the package drawing.
Electrical Characteristics ⁽¹⁾
Unless otherwise specified, all limits are ensured for T_A = 25°C, Input CM = 2.5V, V_CM = 1.2V, V_{CM_Aux} = 1.2V, Single-ended
input drive, V_CC = 5V, V_DD = 3.3V, R_L = 100Ω differential (both Main & Auxiliary Outputs), V_OUT = 0.7 V_PP differential (both
Main & Auxiliary Outputs), both Main and Auxiliary Output Specifications, full bandwidth setting, gain = 18.8 dB (Preamp LG,
0 dB ladder attenuation), Full Power setting ⁽²⁾. Electrical Characteristics Definition of Terms and Specifications for
abbreviations used in the datasheet. Boldface limits apply at the temperature extremes.
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T_J = T_A. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T_J > T_A.
(2) “Full Power” setting is with Auxiliary output turned on.
2
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