AM1707 Datasheet, PDF (194/198 Pages) Texas Instruments – AM1707 ARM Microprocessor

AM1707
SPRS637 – FEBRUARY 2010
www.ti.com
8 Mechanical Packaging and Orderable Information
This section describes the device orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
8.1 Device and Development-Support Tool Nomenclature
Figure 8-1 provides a legend for reading the device.
X
AM1707
( ) ZKB ( ) 3
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION
B = Silicon Revision 2.0
DEVICE SPEED RANGE
3 = 375 MHz
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D
= -40°C to 90°C (Industrial Grade)
A
= -40°C to 105°C( Extended Grade)
T
= -40°C to 125°C( Automotive Grade)
PACKAGE TYPE
ZKB = 256 Pin Plastic BGA, with Pb-free
Soldered Balls [Green]
Figure 8-1. Device Nomenclature
8.2 Thermal Data for ZKB
The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical
package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]
PARAMETER
°C/W ⁽¹⁾
°C/W ⁽²⁾
AIR FLOW (m/s)⁽³⁾
RΘ_JC
RΘ_JB
RΘ_JA
Junction-to-case
Junction-to-board
Junction-to-free air
12.8
13.5
N/A
15.1
19.7
N/A
24.5
33.8
0.00
21.9
30
0.50
RΘ_JMA
Junction-to-moving air
21.1
28.7
1.00
20.4
27.4
2.00
19.6
26
4.00
0.6
0.8
0.00
0.8
1
0.50
Psi_JT
Junction-to-package top
0.9
1.2
1.00
1.1
1.4
2.00
1.3
1.8
4.00
14.9
19.1
0.00
14.4
18.2
0.50
Psi_JB
Junction-to-board
14.4
18
1.00
14.3
17.7
2.00
14.1
17.4
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.
Power dissipation of 1W and ambient temp of 70C assumed.
(3) m/s = meters per second
194 Mechanical Packaging and Orderable Information
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