TMS320VC5502_06 Datasheet, PDF (185/190 Pages) Texas Instruments – Fixed-Point Digital Signal Processor

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PACKAGE OPTION ADDENDUM
19-Mar-2008
PACKAGING INFORMATION
Orderable Device
TMS320VC5502GZZ200
TMS320VC5502GZZ300
TMS320VC5502PGF200
TMS320VC5502PGF300
TMS320VC5502ZZZ200
TMS320VC5502ZZZ300
TMX320VC5502GZZ200
TMX320VC5502GZZ300
TMX320VC5502PGF200
TMX320VC5502PGF300
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
Package
Type
BGA MI
CROSTA
R
BGA MI
CROSTA
R
LQFP
Package
Drawing
GZZ
GZZ
PGF
ACTIVE
LQFP
PGF
ACTIVE
BGA MI
CROSTA
R
ACTIVE
BGA MI
CROSTA
R
OBSOLETE BGA MI
CROSTA
R
OBSOLETE BGA MI
CROSTA
R
OBSOLETE LQFP
OBSOLETE LQFP
ZZZ
ZZZ
GZZ
GZZ
PGF
PGF
Pins Package Eco Plan ⁽²⁾
Qty
201 126
TBD
Lead/Ball Finish MSL Peak Temp ⁽³⁾
SNPB
Level-3-220C-168 HR
201 126
TBD
SNPB
Level-3-220C-168 HR
176 40 Green (RoHS & CU NIPDAU Level-4-260C-72 HR
no Sb/Br)
176 40 Green (RoHS & CU NIPDAU Level-4-260C-72 HR
no Sb/Br)
201 126 Green (RoHS & SNAGCU Level-3-260C-168 HR
no Sb/Br)
201 126 Green (RoHS & SNAGCU Level-3-260C-168 HR
no Sb/Br)
201
TBD
Call TI
Call TI
201
TBD
Call TI
Call TI
176
TBD
Call TI
Call TI
176
TBD
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1