LP38869_15 Datasheet, PDF (16/23 Pages) Texas Instruments – 1A FlexCap, Low-Dropout Linear Regulator with 0.75% Accuracy

LP38869
SNVS877B – AUGUST 2012 – REVISED APRIL 2013
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4.0
3.5
JA= ^50°C/W
3.0
JA= ^56°C/W
JA= ^65°C/W
2.5
JA= ^131°C/W
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE, TA(°C)
Figure 36. Maximum Dissipation vs. Ambient Temperature
Figure 37 shows the allowable power dissipation factors for a typical multi-layer PC board at ambient
temperatures of +25°C, +50°C, and +70°C for the AbsMax junction temperature of 150°C.
1.2
1.0
0.8
0.6 _{TA= 75°C}
0.4 ^{TA= 50°C}
TA= 25°C
0.2
0.0 ^{For TJ= 150°C and} JA= ^50°C/W
0
1
2
3
4
5
VIN- VOUT(V)
Figure 37. Maximum Output Current vs Input-Output Differential Voltage
The LP38869 HTSSOP package features an exposed thermal pad on its underside. This exposed pad lowers the
package’s thermal resistance by providing a direct thermal heat path from the die to the PC board. Connect the
exposed thermal pad to circuit ground using a large copper pad (1 square inch is the recommended minimum),
or use multiple thermal vias to the ground plane of a multi-layer PCB.
For the LP38869MH in the HTSSOP Exposed Pad 16-Lead package, the junction-to-case thermal rating, θ_JC, is
16.2°C/W, where the case is the bottom of the package at the center of the Exposed Pad. Typical junction-to-
ambient thermal performance for the LP38869MH, using the JESD51 standards, is summarized in the following
table.
16
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