BQ2018TS-E1 Datasheet, PDF (16/25 Pages) Texas Instruments – Power Minder IC

bq2018
8-Pin TSSOP ~ TS Package Suffix
Dimension
A
A1
B
C
D
E
e
H
L
Millimeters
Min. Max.
-
1.10
0.05 0.15
0.18 0.30
0.09 0.18
2.90 3.10
4.30 4.48
0.65BSC
6.25 6.50
0.50 0.70
Inches
Min. Max.
-
0.043
0.002 0.006
0.007 0.012
0.004 0.007
0.115 0.122
0.169 0.176
0.0256BSC
0.246 0.256
0.020 0.028
Notes:
1. Controlling dimension: millimeters. Inches shown for reference only.
2 'D' and 'E' do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side
3 Each lead centerline shall be located within ±0.10mm of its exact true position.
4. Leads shall be coplanar within 0.08mm at the seating plane.
5 Dimension 'B' does not include dambar protrusion. The dambar protrusion(s) shall not cause the lead width
to exceed 'B' maximum by more than 0.08mm.
6 Dimension applies to the flat section of the lead between 0.10mm and 0.25mm from the lead tip.
7 'A1' is defined as the distance from the seating plane to the lowest point of the package body (base plane).
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