TMS320R2811_11 Datasheet, PDF (147/154 Pages) Texas Instruments – Digital Signal Processors

Mechanical Data
8 Mechanical Data
Table 7−1 through Table 7−4 provide the thermal resistance characteristics for the various packages.
Table 7−1. Thermal Resistance Characteristics for 179-GHH
PARAMETER
179-GHH PACKAGE
UNIT
PsiJT
0.658
°C / W
Θ_JA
42.57
°C / W
Θ_JC
16.08
°C / W
Table 7−2. Thermal Resistance Characteristics for 179-ZHH
PARAMETER
179-ZHH PACKAGE
UNIT
PsiJT
0.658
°C / W
Θ_JA
42.57
°C / W
Θ_JC
16.08
°C / W
Table 7−3. Thermal Resistance Characteristics for 176-PGF
PARAMETER
176-PGF PACKAGE
UNIT
PsiJT
0.247
°C / W
Θ_JA
41.88
°C / W
Θ_JC
9.73
°C / W
Table 7−4. Thermal Resistance Characteristics for 128-PBK
PARAMETER
128-PBK PACKAGE
UNIT
PsiJT
Θ_JA
0.271
41.65
°C / W
°C / W
Θ_JC
10.76
°C / W
The following mechanical package diagram(s) reflect the most current released mechanical data available for
the designated device(s).
June 2004 − Revised June 2006
SPRS257C 147