TMS320C5514_1 Datasheet, PDF (141/144 Pages) Texas Instruments – TMS320C5514 Fixed-Point Dight Signal Processor

TMS320C5514
www.ti.com
SPRS646A – JANUARY 2010 – REVISED MARCH 2010
7 Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance characteristics for the PBGA–ZCH mechanical
package.
7.1 Thermal Data for ZCH
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCH]
NO.
1 RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
1S0P
1S0P
2S2P
1S0P
2S2P
°C/W ⁽¹⁾
6.74
14.5
13.8
57.0
33.4
0.09
13.7
AIR FLOW
(m/s) ⁽²⁾
N/A
N/A
0.00
0.50
1.00
2.00
3.00
0.00
0.50
1.00
2.00
3.00
0.00
0.50
1.00
2.00
3.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
(2) m/s = meters per second
7.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2010, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information 141
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