DS92001 Datasheet, PDF (14/17 Pages) National Semiconductor (TI) – 3.3V B/LVDS-BLVDS Buffer

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PACKAGE MATERIALS INFORMATION
24-Apr-2013
*All dimensions are nominal
Device
DS92001TLD
DS92001TLD/NOPB
DS92001TMAX
DS92001TMAX/NOPB
Package Type
WSON
WSON
SOIC
SOIC
Package Drawing Pins
NGK
8
NGK
8
D
8
D
8
SPQ
1000
1000
2500
2500
Length (mm)
210.0
213.0
349.0
349.0
Width (mm)
185.0
191.0
337.0
337.0
Height (mm)
35.0
55.0
45.0
45.0
Pack Materials-Page 2