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DS92001 Datasheet, PDF (13/17 Pages) National Semiconductor (TI) – 3.3V B/LVDS-BLVDS Buffer
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
24-Apr-2013
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DS92001TLD
WSON NGK 8
DS92001TLD/NOPB WSON NGK 8
DS92001TMAX
SOIC
D
8
DS92001TMAX/NOPB SOIC
D
8
SPQ
1000
1000
2500
2500
Reel Reel A0 B0 K0 P1 W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
178.0 12.4 3.3 3.3 1.0 8.0 12.0
Q1
178.0 12.4 3.3 3.3 1.0 8.0 12.0
Q1
330.0 12.4 6.5 5.4 2.0 8.0 12.0
Q1
330.0 12.4 6.5 5.4 2.0 8.0 12.0
Q1
Pack Materials-Page 1